1TB in a single 16x20mm SMT package

January 09, 2019 // By Julien Happich
Toshiba Memory Europe introduced its fourth generation single package ball grid array (BGA) solid state drive (SSD) BG4 series, placing both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centers.

Utilizing Toshiba Memory’s innovative 96-layer BiCS FLASH 3D memory, BG4 increases the maximum capacity from 512GB to 1024GB (approximately 1TB) and provides a slim 1.3mm profile for capacities up to 512GB. Furthermore, the BG4 series doubles the PCIe Gen3 lane count from 2 to 4, delivering more performance in the same power envelope when compared to the prior generation product. The devices supports up to 2,250 MB/s sequential read and up to 1,700 MB/s sequential write performance. Compared to their predecessors, BG4 SSDs feature a power-saving solution that improves power efficiency up to 20 percent in read and 7 percent in write and provides a low-power state as low as 5mW. The BG4 also improved its Host Memory Buffer (HMB) technology by increasing the accelerated read access range and optimizing background flash management. The new single package SSD is available in capacities of 128GB, 256GB, 512GB, and 1024GB (approximately 1TB), in either surface-mount BGA M.2 1620 (16x20mm) or removable M.2 2230 (22x30mm) module. Pyrite drive (version 1.00) or self-encrypting drive (TCG Opal version 2.01) models are also available.

Toshiba Memory - https://business.toshiba-memory.com


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